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CAS NO. 13391-72-5 Dimethyl(dimethylamino)vinylsilane

Product name Dimethyl(dimethylamino)vinylsilane
CAS NO. 13391-72-5
Purity 95% min
Product Features
CAS NO. 13391-72-5 Dimethyl(dimethylamino)vinylsilane
Product Name Dimethyl(dimethylamino)vinylsilane
Synonyms (Dimethylamino)dimethylvinylsilane; (Dimethylamino)vinyldimethylsilane; Vinyldimethyl(dimethylamino)silane; N,N-Dimethylvinyldimethylsilanamine; Me₂ViSi–NMe₂
CAS NO. 13391-72-5
Appearance Colorless to pale yellow liquid
Purity 95% min
MF C6H15NSi
MW 129.28 g/mol
Storage Preserve in a well-closed container and keep in cool, dry place, avoid light.
Package In fluoride bottle/ Fluoride drums/iron drums/plastic drums/IBC Tank ,etc.
Shipment method By Sea, Air, Courier door to door, etc.
Loading Port China any port, Beijing, Shanghai, Hong Kong etc.
Application 1. Semiconductor ALD/CVD precursor (primary use): Vinyl-functional aminosilane for plasma-enhanced ALD and CVD of silicon carbonitride (SiCN) and carbon-doped SiNx films. The vinyl group (Si–CH=CH₂) is a built-in carbon source that raises film carbon content, enabling low-dielectric-constant SiCN etch-stop/cap layers and tunable film composition in logic interconnects — with halogen-free, self-limiting growth and no NH₄Cl by-product.
2. Low-k / etch-stop film tuning: Delivers carbon-rich SiCN with controlled density, etch selectivity and stress; the vinyl ligand can also crosslink during or after deposition, stabilizing film structure.
3. Silylation & coupling reagent: Combines a labile Si–NMe₂ group (amine-liberating silylation, volatile by-products) with a vinyl handle for hydrosilylation / free-radical coupling — used for surface functionalization, vinyl-functional silicone/PVMS polymer synthesis and nanoparticle modification.
Contact Contact person: James Zhang

Email: james.zhang@dakenchem.com

Frequently Asked Questions:

What is Dimethyl(dimethylamino)vinylsilane (CAS 13391-72-5)?

It is a vinyl-functional organoaminosilane with the linear formula CH₂=CH–Si(CH₃)₂–N(CH₃)₂ (CAS 13391-72-5, molecular formula C₆H₁₅NSi, MW 129.28). On one silicon center it carries one dimethylamino leaving group, two methyl groups and one vinyl group — a compact, highly volatile liquid used both as a SiCN deposition precursor and as a dual-purpose silylation/coupling reagent.

Is this the same product as (dimethylamino)dimethylvinylsilane?

Yes — (dimethylamino)dimethylvinylsilane, (dimethylamino)vinyldimethylsilane and vinyldimethyl(dimethylamino)silane are the same compound, CAS 13391-72-5. Note it is a different molecule from bis(dimethylamino)methylvinylsilane (CAS 13368-45-1), which carries two dimethylamino groups and one methyl plus one vinyl group. Confirm orders by CAS number.

What is it used for in semiconductor manufacturing?

It is used as a silicon precursor for ALD/CVD of silicon carbonitride (SiCN) and carbon-doped SiNx films. The Si–CH=CH₂ vinyl group acts as a built-in carbon source, so carbon-rich, low-dielectric-constant SiCN films can be grown for etch-stop/cap layers in Cu/low-k interconnects, spacers and passivation, with chlorine-free chemistry.

How does the vinyl group change film behavior compared with plain aminosilanes?

A vinyl ligand contributes more carbon than a methyl group and can participate in crosslinking/incorporation reactions during plasma deposition, shifting film composition toward carbon-rich SiCN. This typically lowers the dielectric constant and changes etch selectivity, density and stress — useful knobs for low-k etch-stop and spacer tuning. It also leaves a polymerizable handle in surface-modification applications.

What purity do you supply?

Our standard grade is 95% min (by GC), with COA per batch, suitable for R&D, pilot evaluation and synthesis use. Higher-assay or tighter-specification batches (controlled moisture, trace metals) for electronic-grade evaluation can be custom produced against your target specification.

What are the key physical properties for process design?

Boiling point about 109 °C; density about 0.77 g/mL at 25 °C. It is a small, highly volatile molecule, convenient for bubbler / vapor-draw delivery. Reference sources do not report a consistent flash-point value, so please rely on the figure in the delivered batch SDS rather than catalog estimates.

How should it be stored and handled?

It is moisture-sensitive: the Si–N bond hydrolyzes with water, releasing dimethylamine. Store tightly sealed under dry nitrogen or argon, cool, dry and dark. Transfer via glovebox or Schlenk/cannula technique with inert-gas-purged lines and cylinders; avoid ignition sources (flammable liquid). See the SDS for full guidance.

What packaging options are available?

Standard packaging is fluoride bottles, fluorinated / iron / plastic drums or IBC tanks according to order quantity. Material is sealed dry under inert conditions before dispatch. Small sealed sample bottles are available for evaluation; cylinders, ampoules and custom fittings can be arranged for production use.

Are COA, SDS and regulatory documents provided? How is it shipped?

Yes — COA and SDS ship with every batch; TDS, REACH/TSCA and origin documents are available on request. It is classified as a flammable, corrosive, moisture-reactive dangerous good (UN 2924 type entries) and is shipped through certified DG channels by air, sea or courier with complete dangerous-goods documentation.

Can I get a sample, custom specification or small-batch supply?

Yes. We support gram-scale samples for process evaluation, custom specification batches, and scale-up to production volumes with stable lead times. Tell us your target application (SiCN etch-stop, carbon-rich SiNx, vinyl-functional silylation…), grade and cylinder type, and we will reply with specification, price, lead time and sample availability — usually within one working day. Contact James Zhang at james.zhang@dakenchem.com.

Application Cases:

Case 1 — Logic Interconnect: Carbon-Rich SiCN Etch-Stop / Cap Layer

In Cu/low-k stacks, the vinyl ligand supplies high carbon content to PEALD SiCN films, lowering dielectric constant while maintaining etch selectivity and copper-barrier performance — targeting the etch-stop/cap layer between low-k levels.

Case 2 — Halogen-Free SiCN Deposition Development

The molecule gives ALD/CVD process teams a single-precursor route to carbon-rich SiCN with no chlorine and no NH₄Cl handling, useful when screening vinyl- vs methyl-aminosilane families for film density and wet-etch-rate tuning.

Case 3 — Vinyl-Functional Surface Silylation

The Si–NMe₂ group silylates silanol surfaces under mild conditions, releasing only volatile dimethylamine, while the vinyl group remains available for subsequent hydrosilylation or radical grafting — used to functionalize silica, fillers and nanoparticles with polymerizable handles.

Case 4 — Vinylsilicone (PVMS) Polymer & Resin Crosslinker

As a vinylsilane building block it participates in free-radical and hydrosilylation cure of vinyl-functional silicones and resins, improving crosslink density and organic–inorganic adhesion in specialty encapsulant and coating formulations.

Case 5 — Low-Temperature Passivation / Barrier Film Research

Its high volatility and moderate boiling point support low-temperature vapor delivery for exploratory SiCN/SiCN-type barrier and passivation films on temperature-sensitive substrates, complementing oxide/nitride barrier stacks in display and packaging R&D.

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